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- Printed circuit board layout advice.
- Clearance constraint and minimum tolerance
considerations for wire bonding your chip.
- Package / socket selection advice.
- Wirebonder equipment diagnostics
and trouble-shooting,
- Application diagnostics and trouble shooting.
- Packaging advice.
- Printed
circuit board layout advice regarding bare die packaging.
- Hybrid packaging advice.
- Wirebonder training.
- Other
packaging questions and issues.
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